Heat-resistant adhesive film

Provided is a heat-resistant adhesive film for a semiconductor package manufacturing process, which has low adhesive force at room temperature, excellent adhesiveness to a lead frame, and excellent reworkability, and which, after being adhered to the lead frame, immediately increases in adhesive force to the lead frame in a high-temperature environment that serves as a sealing process even without a heat treatment process. Resin leakage can be prevented. A heat-resistant adhesive film in which a substrate and a silicone adhesive layer formed by curing at least an addition-curable silicone composition on one surface of the substrate are laminated, and a cured silicone material constituting the silicone adhesive layer is a cured silicone material having a phenolic hydroxyl group. 本发明提供一种半导体封装制造工序用的耐热性粘合膜，其在常温下为低粘合力，对引线框架的粘贴性、再加工性良好，在粘贴于引线框架之后，即使没有热处理工序，在成为密封工序的高温环境时，与引线框架的粘合力也立即上升，能够防止树脂泄漏。一种耐热性粘合膜，其层叠有基材和在所述基材的一个面上至少使加成固化型有机硅组合物固化而成的有机硅粘合剂层，构成所述有机硅粘合剂层的有机硅固化物为具有酚羟基的有机硅固化物。