Combined bus duct for engineering

The invention discloses a combined bus duct for engineering, and particularly relates to the technical field of bus ducts, a heat dissipation device, an ultrasonic sensor, a temperature sensor and a controller are arranged to control the working state of the heat dissipation device, and the heat dis...

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Bibliographische Detailangaben
Hauptverfasser: WU SUXIN, DONG JIANJIAN, YE DAXIN, ZHOU LIANG, ZHANG MIAO, DIAO YUEJUN, ZHANG CHUAN, LIU HONGJUAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a combined bus duct for engineering, and particularly relates to the technical field of bus ducts, a heat dissipation device, an ultrasonic sensor, a temperature sensor and a controller are arranged to control the working state of the heat dissipation device, and the heat dissipation device comprises a heat dissipation shell, a heat dissipation shell and a rotating column. An air port is formed in the originally sealed bus duct, and air can enter from the upper heat dissipation device, comes out from the lower heat dissipation device and flows through the whole bus duct in the middle, so that the purpose of cooling is achieved; an overload current coefficient, a temperature anomaly coefficient and a wire damage coefficient are collected and processed to generate an evaluation coefficient, the evaluation coefficient is compared with an evaluation coefficient threshold value, if the evaluation coefficient is larger than the evaluation coefficient threshold value, it is proved that the te