Backlight module and manufacturing method thereof
The invention provides a backlight module and a manufacturing method thereof. The backlight module comprises a substrate, a light-emitting element and a conductive layer. The substrate includes a central region and a peripheral region. The peripheral region surrounds the central region. The light-em...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention provides a backlight module and a manufacturing method thereof. The backlight module comprises a substrate, a light-emitting element and a conductive layer. The substrate includes a central region and a peripheral region. The peripheral region surrounds the central region. The light-emitting element is arranged in the central area. The conductive layer is disposed in the peripheral region and electrically connected to the light-emitting element. The conductive layer has a first portion and a second portion. The first portion is closer to the light-emitting element than the second portion. The first portion has a first metal layer area, the second portion has a second metal layer area, and the first metal layer area is larger than the second metal layer area. According to the backlight module and the manufacturing method thereof disclosed by the embodiment of the invention, the loss of laser energy can be reduced or the cutting yield can be improved in the cutting step of the manufacturing proces |
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