Method for testing heat transfer characteristic of embedded pipe type enclosure structure

The invention discloses a test method for heat transfer characteristics of an embedded pipe type enclosure structure. The test method comprises the following steps: S1, manufacturing a wall body test piece; s2, installing a temperature sensor and a heat flow sensor; s3, building a test box body; s4,...

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Hauptverfasser: MIAO TONG, WANG YOU, ZHU WEI, JI MINGXIAO, ZHU YUANYUAN, ZHU XU, SHI XIANTAO, HAO YUNING, HUANG JIANEN, ZHANG SHUOYANG, DING FUHUA
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a test method for heat transfer characteristics of an embedded pipe type enclosure structure. The test method comprises the following steps: S1, manufacturing a wall body test piece; s2, installing a temperature sensor and a heat flow sensor; s3, building a test box body; s4, assembling a test testing system; and S5, starting the experimental test system, monitoring the wall body test piece on line, calculating various performance data of the wall body test piece through an algorithm, summarizing and analyzing a temperature field and a heat flow field in the wall body test piece to obtain the heat transfer characteristic of the wall body test piece, and finally completing the experimental test of the heat transfer characteristic of the wall body test piece. According to the invention, the thermal property of the wallboard in the enclosure structure can be accurately and comprehensively detected, the technical defect problem existing in a traditional detection method is solved, and the