Preparation method of PCB copper foil

The invention provides a PCB copper foil preparation method, and relates to the technical field of copper foils, and the PCB copper foil preparation method comprises the following steps: selecting a copper material and waste copper with the same purity as the copper material as main materials, and a...

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Bibliographische Detailangaben
Hauptverfasser:	YE MING, ZHONG MENGJIE, HUANG JIAQUAN, LI QILAN, XU CHENG, WEI MING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS INORGANIC CHEMISTRY MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TREATMENT OF ALLOYS OR NON-FERROUS METALS
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