Preparation method of PCB copper foil

The invention provides a PCB copper foil preparation method, and relates to the technical field of copper foils, and the PCB copper foil preparation method comprises the following steps: selecting a copper material and waste copper with the same purity as the copper material as main materials, and a...

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Bibliographische Detailangaben
Hauptverfasser: YE MING, ZHONG MENGJIE, HUANG JIAQUAN, LI QILAN, XU CHENG, WEI MING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a PCB copper foil preparation method, and relates to the technical field of copper foils, and the PCB copper foil preparation method comprises the following steps: selecting a copper material and waste copper with the same purity as the copper material as main materials, and adding the main materials into a copper dissolving pool; deionized water and sulfuric acid are added into the copper melting pool, and a copper sulfate solution is generated after reaction; the copper sulfate solution is filtered, annealed and subjected to impurity removal, and a treated solution is obtained; electrolyzing the treatment solution, depositing to form a copper foil, stripping and pretreating to obtain a raw foil; according to the method, the means of combining electrolytic copper making and hydraulic machine hammering and rolling is adopted, the raw foil is prepared through an electrolytic method, the conductivity of the raw foil is guaranteed, part of the raw foil is subjected to wire drawing, multipl