Preparation method of PCB copper foil
The invention provides a PCB copper foil preparation method, and relates to the technical field of copper foils, and the PCB copper foil preparation method comprises the following steps: selecting a copper material and waste copper with the same purity as the copper material as main materials, and a...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YE MING ZHONG MENGJIE HUANG JIAQUAN LI QILAN XU CHENG WEI MING |
| description | The invention provides a PCB copper foil preparation method, and relates to the technical field of copper foils, and the PCB copper foil preparation method comprises the following steps: selecting a copper material and waste copper with the same purity as the copper material as main materials, and adding the main materials into a copper dissolving pool; deionized water and sulfuric acid are added into the copper melting pool, and a copper sulfate solution is generated after reaction; the copper sulfate solution is filtered, annealed and subjected to impurity removal, and a treated solution is obtained; electrolyzing the treatment solution, depositing to form a copper foil, stripping and pretreating to obtain a raw foil; according to the method, the means of combining electrolytic copper making and hydraulic machine hammering and rolling is adopted, the raw foil is prepared through an electrolytic method, the conductivity of the raw foil is guaranteed, part of the raw foil is subjected to wire drawing, multipl |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118516714A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118516714A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118516714A3</originalsourceid><addsrcrecordid>eNrjZFANKEotSCxKLMnMz1PITS3JyE9RyE9TCHB2UkjOLyhILVJIy8_M4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYWpoZm5oYmjsbEqAEABh8mkw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Preparation method of PCB copper foil</title><source>esp@cenet</source><creator>YE MING ; ZHONG MENGJIE ; HUANG JIAQUAN ; LI QILAN ; XU CHENG ; WEI MING</creator><creatorcontrib>YE MING ; ZHONG MENGJIE ; HUANG JIAQUAN ; LI QILAN ; XU CHENG ; WEI MING</creatorcontrib><description>The invention provides a PCB copper foil preparation method, and relates to the technical field of copper foils, and the PCB copper foil preparation method comprises the following steps: selecting a copper material and waste copper with the same purity as the copper material as main materials, and adding the main materials into a copper dissolving pool; deionized water and sulfuric acid are added into the copper melting pool, and a copper sulfate solution is generated after reaction; the copper sulfate solution is filtered, annealed and subjected to impurity removal, and a treated solution is obtained; electrolyzing the treatment solution, depositing to form a copper foil, stripping and pretreating to obtain a raw foil; according to the method, the means of combining electrolytic copper making and hydraulic machine hammering and rolling is adopted, the raw foil is prepared through an electrolytic method, the conductivity of the raw foil is guaranteed, part of the raw foil is subjected to wire drawing, multipl</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS ; CHEMISTRY ; COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; FERROUS OR NON-FERROUS ALLOYS ; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS ; INORGANIC CHEMISTRY ; MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; METALLURGY OF IRON ; MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240820&DB=EPODOC&CC=CN&NR=118516714A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240820&DB=EPODOC&CC=CN&NR=118516714A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YE MING</creatorcontrib><creatorcontrib>ZHONG MENGJIE</creatorcontrib><creatorcontrib>HUANG JIAQUAN</creatorcontrib><creatorcontrib>LI QILAN</creatorcontrib><creatorcontrib>XU CHENG</creatorcontrib><creatorcontrib>WEI MING</creatorcontrib><title>Preparation method of PCB copper foil</title><description>The invention provides a PCB copper foil preparation method, and relates to the technical field of copper foils, and the PCB copper foil preparation method comprises the following steps: selecting a copper material and waste copper with the same purity as the copper material as main materials, and adding the main materials into a copper dissolving pool; deionized water and sulfuric acid are added into the copper melting pool, and a copper sulfate solution is generated after reaction; the copper sulfate solution is filtered, annealed and subjected to impurity removal, and a treated solution is obtained; electrolyzing the treatment solution, depositing to form a copper foil, stripping and pretreating to obtain a raw foil; according to the method, the means of combining electrolytic copper making and hydraulic machine hammering and rolling is adopted, the raw foil is prepared through an electrolytic method, the conductivity of the raw foil is guaranteed, part of the raw foil is subjected to wire drawing, multipl</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</subject><subject>CHEMISTRY</subject><subject>COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS</subject><subject>INORGANIC CHEMISTRY</subject><subject>MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>METALLURGY OF IRON</subject><subject>MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFANKEotSCxKLMnMz1PITS3JyE9RyE9TCHB2UkjOLyhILVJIy8_M4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYWpoZm5oYmjsbEqAEABh8mkw</recordid><startdate>20240820</startdate><enddate>20240820</enddate><creator>YE MING</creator><creator>ZHONG MENGJIE</creator><creator>HUANG JIAQUAN</creator><creator>LI QILAN</creator><creator>XU CHENG</creator><creator>WEI MING</creator><scope>EVB</scope></search><sort><creationdate>20240820</creationdate><title>Preparation method of PCB copper foil</title><author>YE MING ; ZHONG MENGJIE ; HUANG JIAQUAN ; LI QILAN ; XU CHENG ; WEI MING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118516714A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS</topic><topic>CHEMISTRY</topic><topic>COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS</topic><topic>INORGANIC CHEMISTRY</topic><topic>MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>METALLURGY OF IRON</topic><topic>MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><toplevel>online_resources</toplevel><creatorcontrib>YE MING</creatorcontrib><creatorcontrib>ZHONG MENGJIE</creatorcontrib><creatorcontrib>HUANG JIAQUAN</creatorcontrib><creatorcontrib>LI QILAN</creatorcontrib><creatorcontrib>XU CHENG</creatorcontrib><creatorcontrib>WEI MING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YE MING</au><au>ZHONG MENGJIE</au><au>HUANG JIAQUAN</au><au>LI QILAN</au><au>XU CHENG</au><au>WEI MING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Preparation method of PCB copper foil</title><date>2024-08-20</date><risdate>2024</risdate><abstract>The invention provides a PCB copper foil preparation method, and relates to the technical field of copper foils, and the PCB copper foil preparation method comprises the following steps: selecting a copper material and waste copper with the same purity as the copper material as main materials, and adding the main materials into a copper dissolving pool; deionized water and sulfuric acid are added into the copper melting pool, and a copper sulfate solution is generated after reaction; the copper sulfate solution is filtered, annealed and subjected to impurity removal, and a treated solution is obtained; electrolyzing the treatment solution, depositing to form a copper foil, stripping and pretreating to obtain a raw foil; according to the method, the means of combining electrolytic copper making and hydraulic machine hammering and rolling is adopted, the raw foil is prepared through an electrolytic method, the conductivity of the raw foil is guaranteed, part of the raw foil is subjected to wire drawing, multipl</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN118516714A |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS INORGANIC CHEMISTRY MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| title | Preparation method of PCB copper foil |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T19%3A02%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YE%20MING&rft.date=2024-08-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN118516714A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |