High-thermal-conductivity difunctional particle filler and preparation method thereof

The invention relates to a high-thermal-conductivity difunctional particle filler and a preparation method thereof, and belongs to the technical field of electronic packaging. According to the preparation method, SiO2 microspheres and Al2O3 powder which are uniform in particle size are prepared through a sol-gel method, AlN powder is synthesized through a carbon thermal reduction nitridation synthesis reaction, and the SiO2 microspheres and the AlN powder are compounded for use, so that the interface thermal resistance of the AlN powder in a base material is reduced, and the thermal conductivity of the thermal interface material is improved. 本发明是关于一种高导热双功能颗粒填料及其制备方法，属于电子封装技术领域。该制备方法通过溶胶-凝胶法分别制备出粒径均匀的SiO2微球以及Al2O3粉体，并通过碳热还原氮化合成反应合成了AlN粉体，将SiO2微球和AlN粉体复配使用，降低了AlN粉体在基体材料中界面热阻，提高了热界面材料的热导率。