Electronic device including printed circuit board structure containing thermal interface material

According to various embodiments, an electronic device may include: a substrate (24); a first member (27) provided on the substrate; a second component (28) disposed on the substrate and disposed at a position spaced apart from the first component; an interposer (23) connected to the substrate and surrounding the first component and the second component; a cover plate (22) including a cover plate main body (221) connected to the interposer and covering the first member and the second member, and a cover hole (222) formed to penetrate through the cover plate main body; and a heat dissipation plate (21) including a heat dissipation plate main body (211) provided on the cover plate main body and facing the first member and the second member, a heat dissipation hole (21a) formed to penetrate the heat dissipation plate main body and communicate with the cover hole, and a flow guide (212) formed on the heat dissipation plate main body and guiding a flow of the thermal interface material. Many other embodiments are