Resin composition

The purpose of the present invention is to provide a resin composition suitable for forming an adhesive layer suitable as an impact-absorbing layer having both impact-absorbing properties and heat resistance. The present invention relates to a resin composition for forming an adhesive layer. In the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	UENO SHUSAKU, KATO KAZUMICHI, HIRAYAMA TAKAMASA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a resin composition suitable for forming an adhesive layer suitable as an impact-absorbing layer having both impact-absorbing properties and heat resistance. The present invention relates to a resin composition for forming an adhesive layer. In the present invention, the storage modulus G '(100k) of the adhesive layer at 100 kHz and 25 DEG C is 60 MPa or less, and the resin composition contains an active energy ray-curable compound. 本发明的目的在于提供一种树脂组合物，该树脂组合物适合用于形成适合作为兼顾冲击吸收性与耐热性的冲击吸收层的粘合剂层。本发明涉及一种用于形成粘合剂层的树脂组合物。在本发明中，上述粘合剂层在100kHz、25℃下的储能模量G'(100k)为60MPa以下，上述树脂组合物含有活性能量射线固化型化合物。