Resin composition

The purpose of the present invention is to provide a resin composition suitable for forming an adhesive layer suitable as a shock-absorbing layer having both shock-absorbing properties, processability and workability. The present invention relates to a resin composition for forming an adhesive layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	UENO SHUSAKU, KATO KAZUMICHI, HIRAYAMA TAKAMASA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a resin composition suitable for forming an adhesive layer suitable as a shock-absorbing layer having both shock-absorbing properties, processability and workability. The present invention relates to a resin composition for forming an adhesive layer. The present invention is characterized in that the storage modulus G '(1) [Pa] of the adhesive layer at 1 Hz and 25 DEG C and the storage modulus G' (100k) [Pa] of the adhesive layer at 100 kHz and 25 DEG C satisfy the relationship G '(100k)/G' (1) < = 90. 本发明的目的在于提供一种树脂组合物，该树脂组合物适合用于形成适合作为兼顾冲击吸收性与加工性、操作性的冲击吸收层的粘合剂层。本发明涉及一种用于形成粘合剂层的树脂组合物。本发明的特征在于：上述粘合剂层的1Hz、25℃下的储能模量G'(1)[Pa]与上述粘合剂层的100kHz、25℃下的储能模量G'(100k)[Pa]满足G'(100k)/G'(1)≤90的关系。