Novel power device two-phase heat dissipation module structure

The invention relates to a novel two-phase heat dissipation module structure of a power device. The novel two-phase heat dissipation module structure comprises a cooling water upper cover plate, cooling water channel fins, a cooling water loop and refrigerant loop heat exchange plate, a refrigerant vapor state bin, a refrigerant flowing loop, a refrigerant liquid state bin and a refrigerant loop lower cooling plate which are connected in sequence. The cooling water upper cover plate is provided with a cooling liquid inlet and a cooling liquid outlet, the refrigerant vapor state bin is provided with a refrigerant injection port, and the refrigerant loop lower cooling plate is fixedly connected with a power device needing heat dissipation. Compared with the prior art, the invention has the advantages of higher heat exchange efficiency, good uniform temperature and heat dissipation performance and suitability for high-power density equipment: a refrigerant is used as a medium, has higher specific heat capacity a