Detecting device chip assembly, manufacturing method and related equipment thereof

The invention provides a detector chip assembly, a manufacturing method and related equipment, through the detector chip assembly manufactured by the invention, a P-N-P junction can be formed between adjacent pixels, the problem of large crosstalk caused by movement of carriers of a traditional plan...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FANG WENDE, SONG JIANGMENG, AN LIAN, LI XINGPENG, ZHOU SHUAIKUN, LIU QINGSONG, CHEN HUANHUAN, WU XINXIU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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