Semiconductor packaging structure, forming method and semiconductor packaging assembly

A semiconductor package structure includes a first device, a bonding structure on the first device, a second device connected to the first device, and a copper connector on the second device. The bonding structure includes a copper substrate disposed on the first element and a copper protrusion disposed on the copper substrate. The second element is connected to the first element by joining the copper protrusion and the copper connector, and the copper protrusion is in contact with the copper connector. 一种半导体封装结构，包括一第一元件、一接合结构位于第一元件上、一第二元件连接至前述第一元件以及一铜连接件位于前述第二元件上。接合结构包括设置于前述第一元件上的一铜基底和设置于铜基底上的铜突出部。第二元件通过将前述铜突出部与前述铜连接件接合而使前述第二元件与前述第一元件连接，并且前述铜突出部与前述铜连接件接触。