Regular hexagonal chip processing technology
The invention relates to a processing technology for a regular hexagonal chip. The processing technology comprises the following steps of area planning, primary photoetching, wet etching, secondary photoetching, electrophoresis passivation, LTO oxidation, third photoetching, surface coating, testing...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a processing technology for a regular hexagonal chip. The processing technology comprises the following steps of area planning, primary photoetching, wet etching, secondary photoetching, electrophoresis passivation, LTO oxidation, third photoetching, surface coating, testing and cutting-up. Compared with the prior art, under the same size, the produced hexagonal chip is larger in chip and welding area, better in corresponding surge level, high in large current resistance and more beneficial to uniform distribution of heat and improvement of the heat dissipation effect, the periphery of the hexagonal chip is a large obtuse angle, compared with a square chip, the hexagonal chip is higher in stamping resistance and stress resistance, and under the synchronous pressure, the service life of the hexagonal chip is prolonged. The right angle of the four-corner chip is easy to damage and break. During packaging, the hexagonal chip is arranged in the graphite boat, so that lead racking operatio |
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