SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MOUNTING METHOD

The present disclosure provides a substrate processing apparatus and a substrate mounting method, which can improve the distribution of residual stress of a substrate to appropriately hold the substrate. The substrate processing apparatus is provided with a holding unit, and a suction surface of the holding unit for sucking a substrate has a circular central region and an annular outer region disposed outside the central region. The holding part has: a first suction pressure generating part for generating a suction pressure for sucking the substrate to the holding part in the central region; and a second suction pressure generation unit for generating a suction pressure for sucking the substrate to the holding unit in the outer region. In addition, the holding portion has an external force applying portion for applying an external force to the substrate in a direction in which the substrate is separated from the holding portion in the outer region. 本公开提供一种基板处理装置和基板载置方法，能够改善基板的残余应力的分布来适当地保持基板。基板处理装置具备保持部，该保持部的