RESIN COMPOSITION, MOLDED ARTICLE AND FILM

The resin composition contains a polyamideimide and an acrylic resin. The polyamide-imide has a structure derived from a diamine, a structure derived from a tetracarboxylic acid dianhydride, and a structure derived from a dicarboxylic acid, and contains a structure derived from a fluoroalkyl-substituted benzidine as the structure derived from the diamine. In the polyamide-imide, the ratio of the dicarboxylic acid-derived structure to the total of the tetracarboxylic acid dianhydride-derived structure and the dicarboxylic acid-derived structure may be 5-80 mol%. The resin composition is suitable for manufacturing molded bodies such as films. 树脂组合物包含聚酰胺酰亚胺和丙烯酸系树脂。聚酰胺酰亚胺具有源自二胺的结构、源自四羧酸二酐的结构和源自二羧酸的结构，且包含源自氟烷基取代联苯胺的结构作为源自二胺的结构。聚酰胺酰亚胺中，相对于源自四羧酸二酐的结构及源自二羧酸的结构的总计，源自二羧酸的结构的比率可为5～80摩尔％。树脂组合物适于薄膜等成型体的制作。