High-robustness power module encapsulated by liquid epoxy

The invention relates to a high-robustness power module encapsulated by liquid epoxy, which comprises a water-cooling pin substrate, a shell arranged on one side of the water-cooling pin substrate, three DBC (Direct Bonding Copper) substrates arranged on the water-cooling pin substrate, a plurality...

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Bibliographische Detailangaben
1. Verfasser:	TANG ZHUOFAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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