High-robustness power module encapsulated by liquid epoxy

The invention relates to a high-robustness power module encapsulated by liquid epoxy, which comprises a water-cooling pin substrate, a shell arranged on one side of the water-cooling pin substrate, three DBC (Direct Bonding Copper) substrates arranged on the water-cooling pin substrate, a plurality of chips arranged on the DBC substrates, and a plurality of power terminals respectively arranged on one sides of the chips, the chip is arranged in the shell, the signal pins are distributed around the chip, and the plastic package body is encapsulated in the shell and formed by curing liquid epoxy resin. According to the power module, the advantages of epoxy plastic package are utilized, the high vibration resistance is achieved, meanwhile, the mold opening cost of a plastic package mold is reduced, the manufacturing cost is reduced, the cured liquid epoxy resin has higher hardness and structural strength compared with cured silica gel and epoxy resin, and the service life of the power module is prolonged. And th