Adhesive structure

An adhesive structure in which at least a part of the surface is composed of an inorganic material, the elastic modulus of the surface is within the range of 0.01 GPa to 50 GPa, and the adhesive force when a spherical indenter having a diameter of 40 [mu] m is pressed into the surface using a nanoin...

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Bibliographische Detailangaben
1. Verfasser:	MAENO YOUHEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BLASTING CHEMISTRY DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING DYES ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES THERMAL INSULATION IN GENERAL USE OF MATERIALS AS ADHESIVES WEAPONS
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Beschreibung
Zusammenfassung:	An adhesive structure in which at least a part of the surface is composed of an inorganic material, the elastic modulus of the surface is within the range of 0.01 GPa to 50 GPa, and the adhesive force when a spherical indenter having a diameter of 40 [mu] m is pressed into the surface using a nanoindenter under conditions of a press-in depth of 10 nm and/or 20 nm is 35 N/cm2 or more. 一种粘接结构体，其至少表面的一部分由无机物构成，所述表面的弹性模量在0.01GPa以上且50GPa以下的范围内，在使用纳米压痕仪，将直径40μm的球状压头以压入深度为10nm或20nm中的至少一者的条件压入所述表面时的粘接力为35N/cm2以上。