Elastic wave device

An elastic wave device includes: a resin-made surrounding sealing portion formed on a mounting surface of a package substrate so as to surround a center of the package substrate; a surrounding-shaped protruding part surrounding the center of the device chip is formed on the first outer edge part of the first surface of the device chip; the surrounding protruding part is embedded into the surrounding sealing part, and the packaging substrate is connected with the first outer edge part of the device chip in the surrounding sealing part; the elastic wave device comprises a metal layer, and the metal layer at least covers the second surface of the device chip, covers the side surface of the device chip, and covers the outer side surface of one side, far away from the center of the packaging substrate, of the surrounding-shaped sealing part. According to the embodiment of the invention, the heat dissipation performance, the sealing performance and the thinning performance of the elastic wave device can be more pro