Power device optimized terminal structure and manufacturing method thereof

The invention discloses a power device optimized terminal structure and a manufacturing method thereof. The power device optimized terminal structure comprises a substrate, an epitaxial layer, a main junction, a ring region, a deep ring region, a groove, a passivation layer, an anode electrode and a...

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Hauptverfasser: HUANG RUNHUA, ZHANG YUE, BAI SONG, YANG YONG
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creator HUANG RUNHUA
ZHANG YUE
BAI SONG
YANG YONG
description The invention discloses a power device optimized terminal structure and a manufacturing method thereof. The power device optimized terminal structure comprises a substrate, an epitaxial layer, a main junction, a ring region, a deep ring region, a groove, a passivation layer, an anode electrode and a cathode electrode. M ring regions distributed at intervals and M-1 deep ring regions distributed at intervals are formed in a terminal region of the power device, depletion is assisted by the deep ring regions, the protection effect of a field limiting ring structure is effectively improved, the area of the terminal region is remarkably reduced, meanwhile, a peak electric field at a main junction is effectively reduced, and the withstand voltage of the device is ensured. The invention also discloses a manufacturing method of the device structure. 本发明公开了一种功率器件优化终端结构及其制造方法,该功率器件优化终端结构包括衬底、外延层、主结、环区、深环区、沟槽、钝化层、阳极电极和阴极电极。于功率器件的终端区形成M个间隔分布的环区和M-1个间隔分布的深环区,通过深环区辅助耗尽,有效提升场限环结构的保护效果,在显著减小终端区面积的同时,有效降低主结处峰值电场,保证器件耐压。本发明同时公
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The power device optimized terminal structure comprises a substrate, an epitaxial layer, a main junction, a ring region, a deep ring region, a groove, a passivation layer, an anode electrode and a cathode electrode. M ring regions distributed at intervals and M-1 deep ring regions distributed at intervals are formed in a terminal region of the power device, depletion is assisted by the deep ring regions, the protection effect of a field limiting ring structure is effectively improved, the area of the terminal region is remarkably reduced, meanwhile, a peak electric field at a main junction is effectively reduced, and the withstand voltage of the device is ensured. The invention also discloses a manufacturing method of the device structure. 本发明公开了一种功率器件优化终端结构及其制造方法,该功率器件优化终端结构包括衬底、外延层、主结、环区、深环区、沟槽、钝化层、阳极电极和阴极电极。于功率器件的终端区形成M个间隔分布的环区和M-1个间隔分布的深环区,通过深环区辅助耗尽,有效提升场限环结构的保护效果,在显著减小终端区面积的同时,有效降低主结处峰值电场,保证器件耐压。本发明同时公</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240809&amp;DB=EPODOC&amp;CC=CN&amp;NR=118472014A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240809&amp;DB=EPODOC&amp;CC=CN&amp;NR=118472014A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG RUNHUA</creatorcontrib><creatorcontrib>ZHANG YUE</creatorcontrib><creatorcontrib>BAI SONG</creatorcontrib><creatorcontrib>YANG YONG</creatorcontrib><title>Power device optimized terminal structure and manufacturing method thereof</title><description>The invention discloses a power device optimized terminal structure and a manufacturing method thereof. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Power device optimized terminal structure and manufacturing method thereof
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