Ultrahigh-current-density horizontal acid copper electroplating additive, electroplating method and circuit board

The invention provides an ultra-high current density horizontal type acid copper electroplating additive, an electroplating method and a circuit board. The ultra-high current density horizontal type acid copper electroplating additive is prepared from 0.1 to 1.0 part of PEG-20000, 0.2 to 1.0 part of polyether amine, 0.01 to 0.1 part of sulfur-containing sodium propane sulfonate, 0.01 to 0.2 part of leveling agent, 0.01 to 0.1 part of auxiliary brightening agent and 7.8 to 9.3 parts of deionized water. During acid copper electroplating, sulfur-containing sodium propane sulfonate, high-molecular-weight PEG-20000 and polyether amine are jointly used, so that the current density can be increased to 7.0-8.0 ASD, PEG-20000 is used as a carrier, due to the fact that the molecular weight is large, the PEG-20000 is more easily adsorbed in a high-current-density area in the electroplating process, electrolysis of the high-current area can be fully inhibited, and the electroplating efficiency is improved. The process of