Semiconductor light emitting device
A semiconductor light emitting device includes: a first conductive type semiconductor layer; a second conductive type semiconductor layer disposed on the first conductive type semiconductor layer; an active layer; an electrode layer formed on a top surface of the second conductivity type semiconduct...
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| creator | KIM TAE-HUN PARK GYEONG-SEON JANG TAE-SUNG JUNG DOO-HO LEE SU-YEOL YOO HANUL |
| description | A semiconductor light emitting device includes: a first conductive type semiconductor layer; a second conductive type semiconductor layer disposed on the first conductive type semiconductor layer; an active layer; an electrode layer formed on a top surface of the second conductivity type semiconductor layer; a reflective layer formed on a portion of a top surface of the electrode layer; a bonding pad formed on a top surface of the reflective layer; an insulating layer formed on another portion of the top surface of the electrode layer; and an insulating spacer conformally formed along the surface of the substrate. The reflective layer includes a material that is not etched by an aqueous solution including one of tetramethylammonium hydroxide (TMAH), KOH, NaOH, and NH4OH, and the bond pad has a shell shape including a portion whose width gradually decreases as it is away from the reflective layer.
一种半导体发光装置包括：第一导电类型半导体层；第二导电类型半导体层，其布置在第一导电类型半导体层上；有源层；电极层，其形成在第二导电类型半导体层的顶表面上；反射层，其形成在电极层的顶表面的一部分上；接合焊盘，其形成在反射层的顶表 |
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一种半导体发光装置包括：第一导电类型半导体层；第二导电类型半导体层，其布置在第一导电类型半导体层上；有源层；电极层，其形成在第二导电类型半导体层的顶表面上；反射层，其形成在电极层的顶表面的一部分上；接合焊盘，其形成在反射层的顶表</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240806&DB=EPODOC&CC=CN&NR=118448547A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240806&DB=EPODOC&CC=CN&NR=118448547A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM TAE-HUN</creatorcontrib><creatorcontrib>PARK GYEONG-SEON</creatorcontrib><creatorcontrib>JANG TAE-SUNG</creatorcontrib><creatorcontrib>JUNG DOO-HO</creatorcontrib><creatorcontrib>LEE SU-YEOL</creatorcontrib><creatorcontrib>YOO HANUL</creatorcontrib><title>Semiconductor light emitting device</title><description>A semiconductor light emitting device includes: a first conductive type semiconductor layer; a second conductive type semiconductor layer disposed on the first conductive type semiconductor layer; an active layer; an electrode layer formed on a top surface of the second conductivity type semiconductor layer; a reflective layer formed on a portion of a top surface of the electrode layer; a bonding pad formed on a top surface of the reflective layer; an insulating layer formed on another portion of the top surface of the electrode layer; and an insulating spacer conformally formed along the surface of the substrate. The reflective layer includes a material that is not etched by an aqueous solution including one of tetramethylammonium hydroxide (TMAH), KOH, NaOH, and NH4OH, and the bond pad has a shell shape including a portion whose width gradually decreases as it is away from the reflective layer.
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一种半导体发光装置包括：第一导电类型半导体层；第二导电类型半导体层，其布置在第一导电类型半导体层上；有源层；电极层，其形成在第二导电类型半导体层的顶表面上；反射层，其形成在电极层的顶表面的一部分上；接合焊盘，其形成在反射层的顶表</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor light emitting device |
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