Semiconductor module

The invention relates to a semiconductor module having at least one semiconductor switch and a capacitor component, the capacitor component having a lateral finger structure and comprising a semiconductor substrate, at least two first electrodes, and at least two second electrodes. The first electrode and the second electrode each have the same basic shape and are formed in the semiconductor substrate and/or on the semiconductor substrate alternately next to one another at a predefined distance and are provided for being individually connected via a respective connection region from outside the capacitor component. At least a part of the first electrode and the second electrode is electrically connected via a respective switching region of the capacitor structural element to a respective switching region of the semiconductor switch, and the capacitor structural element and the semiconductor switch are integrated into the semiconductor module. 本发明涉及一种半导体模块，其具有至少一个半导体开关和电容器结构元件，其中，所述电容器结构元件具有横向指状物结构并且包括半导体衬底、至少