Dismounting device for separating silicon carbide substrate slice from ceramic plate

The invention relates to the technical field of semiconductor production equipment, in particular to a dismounting device for separating a silicon carbide substrate slice from a ceramic plate, which comprises an abutting plate with an insertion end used for entering a gap between the edge of the silicon carbide substrate slice and the ceramic plate; the jacking assemblies are arranged on the side, close to the insertion end, of the abutting plate at intervals and used for jacking the edge of the silicon carbide substrate slice; and the driving assembly is connected with the jacking assembly and used for driving the jacking assembly to sequentially jack so as to separate the edge of the silicon carbide substrate slice from the ceramic plate. The jacking assemblies are driven by the driving assembly to sequentially jack so as to separate the edge of the silicon carbide substrate slice from the ceramic disc, so that the edge of the silicon carbide substrate slice is prevented from being damaged, the silicon carb