Method for forming terminal element, terminal element and power semiconductor module arrangement comprising terminal element

The invention relates to a method for forming a terminal element, a terminal element and a power semiconductor module device comprising the terminal element. A method includes stamping a blank from a sheet metal, the blank including a first section and a second section, where the second section is a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MICHALSKI SEBASTIAN, HOHLFELD OLIVER ROBERT, BOENIG GUIDO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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