Method for forming terminal element, terminal element and power semiconductor module arrangement comprising terminal element

The invention relates to a method for forming a terminal element, a terminal element and a power semiconductor module device comprising the terminal element. A method includes stamping a blank from a sheet metal, the blank including a first section and a second section, where the second section is an elongated section having a length in a vertical direction that is at least twice a width thereof in a first horizontal direction, and the first section is a rectangular section having a width in a second horizontal direction that is at least twice a width thereof in a second horizontal direction. The width of the rectangular section in the first horizontal direction is greater than that of the second section; threads are formed on the surface of the first section; and bending the first section to form a sleeve, where the sleeve includes an opening facing the second section in the vertical direction. 本公开内容涉及用于形成端子元件的方法、端子元件和包括端子元件的功率半导体模块装置。一种方法包括：从金属片冲压出坯件，所述坯件包括第一区段和第二区段，其中，所述第二区段是细长区段，所述细长区段在垂直方向上的长度是其在第一水平方向上的