Method and device for determining temperature condition of plate hot working
The invention discloses a plate hot working temperature condition determination method and device. The method comprises the step of carrying out heat treatment on a sample plate according to a set temperature curve. And carrying out performance testing on the plated plate to obtain performance param...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a plate hot working temperature condition determination method and device. The method comprises the step of carrying out heat treatment on a sample plate according to a set temperature curve. And carrying out performance testing on the plated plate to obtain performance parameters of the plated plate, and carrying out performance testing on the matrix plate to obtain performance parameters of the matrix plate. And if the difference value of the performance parameters of the plating plate and the performance parameters of the matrix plate is within a set threshold range, determining that the set temperature curve is a target temperature curve of the temperature condition of hot working. By means of the method and device, the reasonable target temperature curve of the temperature condition for hot working can be determined for the plated plate.
本申请公开了一种板材热加工的温度条件确定方法与装置,该方法包括:根据设定的温度曲线对试样板材进行热处理。对镀层板材进行性能测试,得到镀层板材的性能参数,以及对基体板材进行性能测试,得到基体板材的性能参数。若镀层板材的性能参数和基体板材的性能参数差值在设定的阈值范围之内,则确定设定的温度曲线 |
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