High-entropy hyperelastic memory alloy with low stress lag and high elastic strain and preparation method of high-entropy hyperelastic memory alloy
The invention relates to a high-entropy hyperelastic memory alloy with low stress lag and high elastic strain and a preparation method thereof. The Ti-Ni-Cu-Zr-X high-entropy hyperelastic memory alloy provided by the invention comprises the following chemical components in atomic percent: 29 to 30 p...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a high-entropy hyperelastic memory alloy with low stress lag and high elastic strain and a preparation method thereof. The Ti-Ni-Cu-Zr-X high-entropy hyperelastic memory alloy provided by the invention comprises the following chemical components in atomic percent: 29 to 30 percent of Ti, 34 to 35 percent of Ni, 14 to 15 percent of Cu, 19 to 20 percent of Zr and 0.5 to 1.5 percent of X, wherein the alloy element X is Al, B, Mn, Fe and Mo. The alloy is prepared through the following method that raw materials including Ti, Ni, Cu, Zr and X according to the component proportion are placed in a vacuum arc melting furnace, alloy ingots are obtained through repeated melting, and the as-cast high-entropy hyperelastic memory alloy has low stress lag and high elastic strain, energy loss in the circulation process is small, and stability is good. The as-cast alloy ingot is cut into a columnar sample, and the columnar shape memory alloy with the recovery rate of 100%, high output stress strength |
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