Copper alloy, semi-finished product and electrical connection element comprising copper alloy

The invention relates to a copper alloy having the following components in% by weight: Sn: 3.0%-6.5%, Ni: 0.30%-0.70%, P: 0.15%-0.40%, S: 0.10%-0.40%, Zn: optionally up to 0.20%, Fe: optionally up to 0.50%, Mn: optionally up to 0.50%, Pb: optionally up to 0.25%, the remainder being copper and unavoi...

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Bibliographische Detailangaben
Hauptverfasser: ALLMENDINGER, TIMO, HEILEMANN, JULIA, SCHOBER PATRICK, NACH, MATTHIAS
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to a copper alloy having the following components in% by weight: Sn: 3.0%-6.5%, Ni: 0.30%-0.70%, P: 0.15%-0.40%, S: 0.10%-0.40%, Zn: optionally up to 0.20%, Fe: optionally up to 0.50%, Mn: optionally up to 0.50%, Pb: optionally up to 0.25%, the remainder being copper and unavoidable impurities, where the ratio of the fraction of Ni to the fraction of P is at least 1.1 and up to 2.8, and where the balance is copper and unavoidable impurities. The alloy comprises nickel phosphide. 本发明涉及一种具有按重量计%的以下组分的铜合金:Sn:3.0%-6.5%,Ni:0.30%-0.70%,P:0.15%-0.40%,S:0.10%-0.40%,Zn:任选地,高达0.20%,Fe:任选地,高达0.50%,Mn:任选地,高达0.50%,Pb:任选地,高达0.25%,余量的铜和不可避免的杂质,其中Ni的分数与P的分数的比率是至少1.1,并且至多2.8,并且其中,合金包含磷化镍。