Pad-in-bottle and single platen chemical mechanical planarization for back-end applications

Pad-in-bottle and single platen chemical mechanical planarization for back-end applications

Single platen chemical mechanical planarization (CMP) processes for back-end CMP applications using novel pad-in-bottle (PIB) technology and PIB-type CMP slurries are described to replace multiple (e.g., three) platen chemical mechanical planarization (CMP) processes for back-end CMP applications. A...

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Bibliographische Detailangaben
Hauptverfasser: SCHLUTER, JAMES, A, LANGAN JOHN G, SAMPUNO, YVES, SHI XIAOBO, WAQAS RAHUL, O 'NEILL MARK LEONARD, A.PHILLIPS 'AN
Format: Patent
Sprache:chi ; eng
Schlagworte:
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
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Zusammenfassung:Single platen chemical mechanical planarization (CMP) processes for back-end CMP applications using novel pad-in-bottle (PIB) technology and PIB-type CMP slurries are described to replace multiple (e.g., three) platen chemical mechanical planarization (CMP) processes for back-end CMP applications. A single platen with a single polishing pad is used for an entire back-end CMP process including a metal body, metal soft landing, and metal barrier CMP. 描述了用于后端CMP应用的使用新颖的瓶中垫(PIB)技术和PIB型CMP浆料的单压板化学机械平面化(CMP)工艺，以替代用于后端CMP应用的多(如三)压板化学机械平面化(CMP)工艺。具有单个抛光垫的单压板用于包括金属本体、金属软着陆和金属阻挡CMP的整个后端CMP工艺。