High-heat-dissipation low-stress photovoltaic chip wire box and preparation method thereof

The invention discloses a high-heat-dissipation low-stress photovoltaic chip wire box and a preparation method, and relates to a solar power generation assembly. Comprising a protection shell provided with a packaging cavity; the bottom of the first leading-out conductor is located in the packaging cavity; the top of the substrate extends upwards and extends out of the packaging cavity; the chip is electrically connected to the bottom of the leading-out conductor I; the bottom of the second leading-out conductor is located in the packaging cavity, and the second leading-out conductor is electrically connected with the chip; the top of the substrate extends upwards and extends out of the packaging cavity; and the plastic package body packages the lead-out conductor I, the chip and the lead-out conductor II in a protective shell. According to the invention, the chip mounting position with a groove structure is adopted, the chip is welded and then is wrapped up and down, and a liquid epoxy molding compound injec