Semiconductor structure, circuit and packaging method thereof

The embodiment of the invention relates to the technical field of semiconductors, in particular to a photovoltaic module bypass protection semiconductor structure, a photovoltaic module bypass protection circuit and a photovoltaic module bypass protection semiconductor structure packaging method. Th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHOU LIZHI, LI HENGJUN, WANG YANG, QU XINYU, HE XIAOJUN, WANG SONGZE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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