Semiconductor structure, circuit and packaging method thereof

The embodiment of the invention relates to the technical field of semiconductors, in particular to a photovoltaic module bypass protection semiconductor structure, a photovoltaic module bypass protection circuit and a photovoltaic module bypass protection semiconductor structure packaging method. The photovoltaic module bypass protection semiconductor structure comprises a frame substrate made of a metal material; the chip unit is attached to the surface of the frame substrate; the welding spot unit is arranged on the surface of the frame substrate and is separated from the chip unit; the first end of the lead unit is connected to the surface of the frame substrate through the welding spot unit, the second end of the lead unit is electrically connected with the chip unit, and a protection loop is formed through the lead unit. The invention provides a photovoltaic module bypass protection semiconductor structure which is simple in process, low in cost and higher in flexibility. 本申请实施例涉及半导体技术领域，具体地，涉及一种光伏模组旁路保护