Wafer separation mechanism and separation method

The invention relates to a wafer separation mechanism and a wafer separation method. And the wafer separation mechanism is used for separating the two wafers which are bonded with each other, and the wafer separation mechanism comprises a first adsorption mechanism, a second adsorption mechanism and an air blowing mechanism. The first adsorption mechanism is used for adsorbing a first wafer, the second adsorption mechanism is used for adsorbing a second wafer, the first adsorption mechanism and the second adsorption mechanism are oppositely arranged, and the first adsorption mechanism and/or the second adsorption mechanism are/is used for driving the corresponding wafer to move towards the side away from the second wafer. And meanwhile, the blowing mechanism is used for blowing air between the two wafers. The axial separation force is applied to the wafer, and air is blown between the two wafers at the same time, so that the separation of the first wafer and the second wafer is further accelerated, the pullin