Modeling method of multilayer mechanical model for leek cutting simulation

The invention discloses a multilayer mechanical model modeling method for leek cutting simulation, which comprises the following steps: determining geometric structures and physical parameters of each part of a leek rhizome and measuring mechanical property parameters of the leek rhizome through exp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZOU XIAORUI, ZHU LIN, XIE XINYU, LI YANCHEN, ZHOU WENXUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
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