Modeling method of multilayer mechanical model for leek cutting simulation
The invention discloses a multilayer mechanical model modeling method for leek cutting simulation, which comprises the following steps: determining geometric structures and physical parameters of each part of a leek rhizome and measuring mechanical property parameters of the leek rhizome through exp...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a multilayer mechanical model modeling method for leek cutting simulation, which comprises the following steps: determining geometric structures and physical parameters of each part of a leek rhizome and measuring mechanical property parameters of the leek rhizome through experimental research on growth structures, physical parameters and mechanical properties of the leek rhizome. And according to the measured geometric structure and mechanical property parameters of the Chinese chive rhizome, establishing a multi-layer Chinese chive rhizome mechanical model with a cutting characteristic by using EDEM software. According to the multilayer mechanical model modeling method for leek cutting simulation, an accurate leek rhizome discrete element model can be provided for leek cutting simulation, and a basis is provided for establishing other plant discrete element models with cutting characteristics by using a discrete element method.
本发明公开了一种用于韭菜切割模拟的多层力学模型建模方法,所述方法通过对韭菜根茎的生长结构、物理参数与力学特性的试 |
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