PP resin copmosite used for metallic sputtered film, and the sputtered film therewith

A polypropylene resin composition for a film for metallization, which comprises 100 parts by weight of a polypropylene resin and 0.01 to 1 part by weight of a phosphite represented by the general formula (I): (wherein, R1, R2, R4 and R5 represent individually hydrogen, an alkyl, cycloalkyl, alkylcyc...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OBAYASHI YOSHIAKI, KISHIRO SHIGEKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A polypropylene resin composition for a film for metallization, which comprises 100 parts by weight of a polypropylene resin and 0.01 to 1 part by weight of a phosphite represented by the general formula (I): (wherein, R1, R2, R4 and R5 represent individually hydrogen, an alkyl, cycloalkyl, alkylcycloalkyl, aralkyl or phenyl; R3 represents hydrogen or an alkyl; X represents sulfur atom or a -CHR6- group (R6 represents hydrogen, an alkyl or cycloalkyl); n is 0 or 1; A is an alkylene or a -CO(R7)m- group (R7is an alkylene, mark is indicative of the bonding site of A to oxygen and m is 0 or 1); and either one of Y or Z is hydroxy, alkoxy or aralkyloxy and the other is hydrogen or an alkyl.), a film thereof, and a metallized film thereof.