Defect detection method and system
The invention provides a defect detection method and system, and the method comprises the steps: collecting an original image of the surface of a compound semiconductor in real time, and carrying out the binary segmentation of the original image, so as to generate a corresponding binary image; perfo...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a defect detection method and system, and the method comprises the steps: collecting an original image of the surface of a compound semiconductor in real time, and carrying out the binary segmentation of the original image, so as to generate a corresponding binary image; performing scaling processing on the binary image to generate a corresponding first detection image, and performing scaling processing on the original image to generate a corresponding second detection image; and performing channel splicing processing on the first detection image and the second detection image to fuse a corresponding target detection image, and correspondingly detecting defects existing on the surface of the compound semiconductor in real time according to the target detection image. According to the invention, defects on the surface of the compound semiconductor can be rapidly and accurately detected, and the detection efficiency is correspondingly improved.
本发明提供了一种缺陷检测方法及系统,该方法包括:实时采集化合物半导体表面的原始图像,并对 |
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