METHODS, ASSEMBLIES AND SYSTEMS FOR FILM DEPOSITION AND CONTROL

Methods, systems, and assemblies suitable for use in gas phase processes are disclosed. An exemplary assembly includes a base plate and a base attachment. The base accessory may include a ramp region and a conductance control region located above and outside of the ramp region. Methods, systems, and...

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Bibliographische Detailangaben
Hauptverfasser:	WINKLER JERRY L, MISHRA ABHINAV, STEVENS ERIC C, LUNCEFORD, CHRISTOPHER, RICHARD, MA PENGFEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Methods, systems, and assemblies suitable for use in gas phase processes are disclosed. An exemplary assembly includes a base plate and a base attachment. The base accessory may include a ramp region and a conductance control region located above and outside of the ramp region. Methods, systems, and assemblies may be used to achieve a desired material distribution (e.g., composition and/or thickness) on a substrate surface. 公开了适用于气相过程的方法、系统和组件。示例性组件包括基座板和基座附件。基座附件可以包括斜坡区域和位于斜坡区域上方和外部的电导控制区域。方法、系统和组件可用于在衬底表面上获得期望的材料分布(例如成分和/或厚度)。