Preparation method of ablation-resistant refractory metal tantalum and nitride multilayer coating of ablation-resistant refractory metal tantalum
The invention belongs to the technical field of coating preparation, and particularly relates to a preparation method of an ablation-resistant refractory metal tantalum and nitride multilayer coating thereof, and the preparation method comprises the following steps: alternately depositing Ta layers...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention belongs to the technical field of coating preparation, and particularly relates to a preparation method of an ablation-resistant refractory metal tantalum and nitride multilayer coating thereof, and the preparation method comprises the following steps: alternately depositing Ta layers and TaN layers on the surface of a refractory metal substrate by adopting a magnetron sputtering process to form a Ta/TaN multilayer structure coating, so that the internal stress of the nitride coating can be reduced; and the bonding strength between the coating and the metal substrate is improved, the columnar crystal growth of the coating is blocked, the coating structure is densified, good protection can be effectively provided for the metal substrate, the stripping difficulty of the coating is reduced, and the wear resistance and high-temperature oxidation resistance of a refractory metal workpiece are improved.
本发明属于涂层制备技术领域,具体涉及一种耐烧蚀难熔金属钽及其氮化物多层涂层的制备方法,包括以下步骤:采用磁控溅射工艺在难熔金属基底表面交替沉积Ta层和TaN层,形成Ta/TaN多层结构涂层,能够降低 |
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