Automatic plastic packaging equipment for integrated circuit and use method

The invention relates to the technical field of automatic plastic packaging of integrated circuits, in particular to automatic plastic packaging equipment for an integrated circuit and a using method, the automatic plastic packaging equipment comprises a base and two groups of lower molds, and the two groups of lower molds are respectively mounted at the left and right parts of the top end of the base; the die comprises a base, and further comprises a driving device, a pushing device, a conveying device, a feeding device, two rotating shafts, four connecting rods, an upper die and two ejector pins, the two rotating shafts are rotationally installed on the inner side wall of the base through the driving device, and the bottom ends of the four connecting rods are installed at the front ends and the rear ends of the two rotating shafts correspondingly; the top ends of the four connecting rods are rotationally connected with the front side and the rear side of the upper mold correspondingly, and the two ejector p