Dresser for polishing pad, dressing method, polishing method, and workpiece manufacturing method

The present invention provides a novel dresser that imparts higher flatness to a polishing pad. A dresser for a pad surface for polishing is provided with a circular dressing surface having a diameter DCD facing the pad surface and particles disposed on the dressing surface, the particles share the center of the dressing surface and are disposed in a circumferential region having a diameter PCDn, and the area ratio of the particles disposed in the circumferential region is any one of predetermined types 1, 2, and 3. 本发明提供一种赋予研磨垫更高的平坦度的新颖的修整器。一种修整器，其为研磨用的垫表面的修整器，其中，具备与垫表面对置的直径DCD的圆形的修整面以及配置于该修整面的颗粒，颗粒共用修整面的中心且配置于直径PCDn的圆周区域，配置于圆周区域的颗粒的面积率为规定的1型、2型和3型中的任一种。