Cooling liquid substrate, heat management component and vehicle

The invention provides a cooling liquid substrate, a cooling liquid flow channel is arranged in the cooling liquid substrate, a plurality of interfaces are arranged on the cooling liquid substrate, and the plurality of interfaces comprise a battery loop interface, three water pump interfaces, a mult...

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Bibliographische Detailangaben
Hauptverfasser: WANG LEI, WENG JIAN, ZHANG WANSHAN, ZHU XIAOYONG, SHAO JIAYI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a cooling liquid substrate, a cooling liquid flow channel is arranged in the cooling liquid substrate, a plurality of interfaces are arranged on the cooling liquid substrate, and the plurality of interfaces comprise a battery loop interface, three water pump interfaces, a multi-way valve interface, a condenser interface and a cooler interface. A thermal management component and a vehicle are also provided. By means of the scheme, the complexity of water pipe layout design can be simplified, the utilization rate of the plate heat exchange heat dissipation space is improved, and the occupied space of the heat management system is effectively reduced. 本申请提供了一种冷却液基板,所述冷却液基板中布置有冷却液流道,所述冷却液基板上布置有多个接口,其中,所述多个接口包括:电池回路接口、三个水泵接口、多通阀接口、冷凝器接口和冷却器接口。还提供了一种热管理部件和车辆。利用本申请的方案,能够简化水管布局设计的复杂度,提高板换散热空间的利用率,并且有效降低热管理系统的占用空间。