Semiconductor device, photoelectric conversion system, and movable object

The semiconductor device includes: a first semiconductor substrate; a second semiconductor substrate laminated on the first semiconductor substrate; a first pad to which a first power supply voltage driving an element formed on the first semiconductor substrate is input from the outside; a second pad to which a second power supply voltage driving an element formed on the second semiconductor substrate is input from the outside; a first protection loop disposed on the first semiconductor substrate; and a second protection loop disposed on the second semiconductor substrate, the semiconductor device being characterized in that the first power supply voltage is greater than the second power supply voltage, the first protection loop is connected to the first pad, and the second protection loop is connected to the second pad. 该半导体装置包括：第一半导体基板；第二半导体基板，其层叠在第一半导体基板上；第一焊盘，驱动形成在第一半导体基板上的元件的第一电源电压从外部输入第一焊盘；第二焊盘，驱动形成在第二半导体基板上的元件的第二电源电压从外部输入第二焊盘；第一保护回路，其布置在第一半导体基板上；以及第二保护回路，其布置在第二半导体基板上，半导体装置的特征在于，第一电源电压大于第二电源电压，第一保护回路连接到