Preparation method of curved surface microstructure array and golden LED packaging module

The invention discloses a preparation method of a curved surface microstructure array, and the method comprises the steps: arranging a flexible sacrificial layer on a flexible substrate, preparing a micro-droplet array on the flexible sacrificial layer through an active refrigeration technology, and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG GUANGXU, LUO XIN, LUO JUNSONG, GUO XING, WANG DUYANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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