Preparation method of curved surface microstructure array and golden LED packaging module
The invention discloses a preparation method of a curved surface microstructure array, and the method comprises the steps: arranging a flexible sacrificial layer on a flexible substrate, preparing a micro-droplet array on the flexible sacrificial layer through an active refrigeration technology, and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a preparation method of a curved surface microstructure array, and the method comprises the steps: arranging a flexible sacrificial layer on a flexible substrate, preparing a micro-droplet array on the flexible sacrificial layer through an active refrigeration technology, and then pressing a curved surface optical lens into the flexible sacrificial layer, thereby achieving the transfer and copying of the micro-droplet array to the surface of the curved surface optical lens. The method can realize the preparation of the microstructure array with closely arranged curved surfaces in different shapes, and solves the problem that the microstructure array cannot be prepared on the curved surface by the traditional photoetching and mold imprinting methods. The invention further discloses a golden LED packaging module, the golden LED packaging module comprises LED chips, a substrate, a die bonding layer, a lead, a curved optical lens and a high-light-transmission polymer layer, the surface of |
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