Chip structure and preparation method thereof

The invention relates to a chip structure and a preparation method thereof, and the chip structure comprises a chip body which comprises a first surface and a peripheral surface connected with the first surface; the pre-packaging layer at least surrounds the peripheral surface of the chip body; and the plastic packaging layer covers the first surface and the pre-packaging layer. The pre-packaging layer is firstly arranged to surround the chip structure, and then when the plastic packaging layer is subsequently prepared, the pre-packaging layer reduces the contact area between the plastic packaging layer and the chip structure, so that the stress between the plastic packaging layer and the chip structure is reduced. Moreover, in the process, the pre-packaging layer hardly deforms, so that the expansion deformation factor between the plastic packaging layer and the chip structure is further eliminated, and the warping angle of the plastic packaging layer is reduced. Meanwhile, during heating, the materials of t