SEMICONDUCTOR MANUFACTURING APPARATUS, COATING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The invention provides a semiconductor manufacturing apparatus, a coating apparatus, and a method of manufacturing a semiconductor device, and relates to a technology capable of reducing a variation in at least one of a coating position and a coating amount of a paste. This semiconductor manufacturing apparatus is provided with: a syringe which has a nozzle at the tip thereof and which holds a paste; a first stage; a second stage that supports the substrate on which the paste is applied; an imaging device that captures an image of the paste applied to the first stage; and a control device configured to adjust the application position and the application amount of the replaced syringe on the basis of a recognition result of the first paste applied to the first stage by the syringe before replacement and a recognition result of the second paste applied to the first stage by the replaced syringe. 本发明提供半导体制造装置、涂布装置及半导体器件的制造方法，涉及一种能够减少膏体的涂布位置及涂布量中的至少一方的偏差的技术。半导体制造装置具备：注射器，其在前端具有喷嘴，保存膏体；第一载台；第二载台，其对涂布膏体的基板进行支承；拍摄装置